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  • 回流焊的温测试的方法有哪些
  • 本站编辑:杭州欧海自动化设备有限公司发布日期:2018-05-17 17:47 浏览次数:

回流焊炉温测试仪的基本原理比较简单,它对PCB板的表面贴装元件焊盘印刷锡膏,然后通过自动贴片机把SMD贴放到预先印制好锡膏的焊盘上。比较后,通过回流焊接炉,在回流焊炉中逐渐加热,把锡膏融化,称为回流,接着,把PCB板冷却,焊锡凝固,把元件和焊盘牢固地焊接到一起。

The basic principle of reflow soldering is simple. First, it prints the solder paste on the surface of the surface mounting element of the PCB plate, and then puts the SMD on the solder paste prepared by the automatic patch machine. Finally, through the reflow soldering furnace, gradually heated in the reflow furnace, the solder paste was melted, called reflux, and then the PCB plate was cooled, the solder was solidified, and the components and pads were firmly welded together.

要得到好的回流焊接效果必须有一个好的回流温度曲线。那么什么是一个好的回流曲线呢?一个好的回流曲线应该是对所要焊接的PCB板上的各种表面贴装元件都能够达到良好的焊接,且焊点不仅具有良好的外观品质而且有良好的内在品质的温度曲线。

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A good reflux temperature curve must be provided to achieve good reflow soldering effect. So what is a good reflux curve? A good reflux curve should be a good welding for all the surface mounting elements on the PCB plate to be welded, and the solder joints not only have good appearance quality but also have good internal quality temperature curves.

而锡膏的特性决定回流曲线的基本特性。不同的锡膏由于助焊剂(Flux)有不同的化学组分,因此它的化学变化有不同的温度要求,对回流温度曲线也有不同的要求。一般锡膏供应商都能提供一个参考回流曲线,用户可在此基础上根据自己的产品特性或结合IPC/JEDEC J-STD-020回流炉测温规范来优化制定出一个回流曲线标准。那么应该如何进行回流焊的炉温测试呢?

The characteristics of solder paste determine the basic characteristics of the reflux curve. The solder paste (Flux) has different chemical components because of different solder paste, so its chemical changes have different temperature requirements, and there are different requirements for the reflux temperature curve. Generally, the solder paste supplier can provide a reference reflux curve, and on this basis, the user can optimize the standard of a reflux curve based on its own product characteristics or the IPC/JEDEC J-STD-020 reflow furnace temperature gauge specification. How to test the temperature of reflow soldering?

测试工具

test tools

1.KIC2000炉温测试仪

1.KIC2000 furnace temperature tester

非实时测温仪,通过采样、存储,然后将采集来的数据上载到计算机进行分析。

Non real time thermometer, through sampling and storage, then uploads the collected data to the computer for analysis.

2.热电偶

2. thermocouple

用于感受环境温度的介质。其工作原理是由两种不同成分的导体组成回路,当测温端和参比端存在温差时回路中就会产生热电流,通过电流的大小来反映外界温度的变化。热电偶一般要求较小直径,因为小直径的质量小,响应快,得到的结果较为准确。

A medium used to feel the temperature of the environment. The principle of its working principle is to make up the circuit of two kinds of conductors with different components. When there is a temperature difference between the temperature measuring end and the reference end, the thermal current will be produced in the loop, and the change of the external temperature is reflected by the size of the current. The thermocouple usually requires smaller diameter, because the small diameter of the mass is small, the response is fast, and the result is more accurate.

3.其它工具

3. other tools

高温焊锡、高温胶带、数据传输线等。

High temperature solder, high temperature adhesive tape, data transmission line and so on.

测试点选择原则

Test point selection principle

由于线路板上各个区域所承载的元器件不同,另外炉内热空气的流动,这样就造成板上各处温度也不尽相同,因此在实际测量中要真实、地反映被测产品的温度需要选取合适的测试点。一般遵循以下几个原则。

Due to the different components of the circuit board and the flow of hot air in the furnace, the temperature of all parts on the board is not the same. Therefore, it is necessary to choose the suitable test point in real and comprehensive measurement of the temperature of the measured product. The following principles are generally followed.

1.条件允许情况下尽量多地选取测试点;

1. conditions are allowed to select test points as much as possible.

2.被测点尽量在同一纵轴线上;

2. the measured point is on the same longitudinal axis as far as possible.

3.对温度有特殊要求的元器件;

3. components with special requirements for temperature;

4.板面温度比较高的位置;

The position with the highest temperature of 4. plate surface;

5.板面温度比较低的位置。

5. the lowest temperature of the plate surface.

测试方法

test method

1.选取合适的测试点;

1. select the appropriate test points;

2.将热电偶按照测试仪的要求固定在线路板上,并固定好。线路板选择完全贴装的产品。

2. fix the thermocouple on the circuit board according to the requirements of the tester, and fix it well. The circuit board selects the fully attached product.

3.在测试软件中选择锡膏并设定参数值,将测试仪与主控PC连接并打开,按照软件上的提示完成操作。

3. select solder paste and set the parameter value in the test software. Connect the tester to the main control PC and complete the operation according to the prompt on the software.

4.将线路板和测试仪送入炉中进行测试,此时设定温区温度和预测温度一致。

4. the circuit board and tester are sent into the furnace for testing. At this time, the temperature of the temperature zone is consistent with the predicted temperature.

5.待出炉后将数据线连接,传送炉温数据,传送完毕后模拟出炉温曲线。

5. the data line will be connected and the furnace temperature data will be transmitted after the furnace is released. After the transmission is completed, the furnace temperature curve will be simulated.

6.通过调节使各温区温度达到合适,而后等测试仪冷却后再进行测试,确认无疑后生产。

6. by adjusting the temperature to achieve the appropriate temperature zone, and then test the instrument cooling after testing, no doubt after the production.